Durable card

ABSTRACT

Cards embodying the invention include a core subassembly whose elements define the functionality of the card and a hard coat subassembly attached to the top and/or bottom sides of the core subassembly to protect the core subassembly from wear and tear and being scratched. The core subassembly may be formed solely of plastic layers or of different combinations of plastic and metal layers and may include all the elements of a smart card enabling contactless RF communication and/or direct contact communication. The hard coat subassembly includes a hard coat layer, which typically includes nanoparticles, and a buffer or primer layer formed so as to be attached between the hard coat layer and the core subassembly for enabling the lasering of the core subassembly without negatively impacting the hard coat layer and/or for imparting color to the card.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a Divisional Patent Application of U.S. patentapplication Ser. No. 15/637,092, filed Jun. 29, 2017 which is aDivisional Patent Application of U.S. patent application Ser. No.14/178,436, filed Feb. 12, 2014 which claims priority to U.S.Provisional Patent Application Ser. No. 61/763,948 filed Feb. 13, 2013,the contents of each of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

This invention relates to cards, such as credit cards, plastic cards forID, financial transactions and other uses, having improved durabilityand appearance and to apparatus and methods for making such cards.Included in the manufacture is the application of a clear laminateduring the manufacture of the cards.

The use of plastic credit cards is widespread. A problem with knownplastic cards is that they warp and wear out from repeated use (e.g.,within 3-5 years and after 4000 uses—swipes of the magnetic stripe) andthe markings become faint or scratched. It has therefore been an aim ofthe industry to make cards which are sturdier and whose markings do notfade with repeated use. That is, it is desirable to have plastic cardsthat can last many (e.g., 5-10) years and which can be subjected to avery large number (e.g., 10,000) of uses; especially magnetic stripeuse.

In the past, attempts were made to make the credit card surface harder.For example, cards were made with an ultra violet cured coating.However, all such harder cards were prone to develop cracks due tostress over time. This made these cards undesirable for their intendeduse.

It is therefore desirable to manufacture a hardy, scratch resistantplastic card which is not prone to develop cracks and to make such cardseasy and economical to manufacture.

It is also desirable to manufacture a metal card which is scratchresistant and is also more durable.

SUMMARY OF THE INVENTION

Cards embodying the invention include a hard coat layer formed on topand/or on the bottom of the card. The hard coat layer may be formed ofnano-particles, such as silicate nanoparticles, zinc oxidenanoparticles, silicon dioxide crystalline nano-particles, or any othersuitable nano-particles with a suitable carrier such as a solvent ofwater based acrylates, vinyls, urethane or the like. The hard coat canbe applied by coating techniques such as gravure, reverse roll, directroll, or slot coating.

The hard coat layer may be applied to a card, or to a subassembly usedin forming a card, by means of a special carrier layer. The specialcarrier enables a release layer and a hard coat layer to be attached tothe special carrier layer to form a subassembly which can then beattached and transferred to another subassembly to form an intermediateassembly from which the carrier and release layers can be removed,leaving the hard coat layer as the top and/or bottom layer of the card.

Cards embodying the invention include a core subassembly whose elementsdefine the functionality of the card and a hard coat subassemblyattached to the top and/or bottom sides of the core subassembly. Thecore subassembly may be formed solely of plastic layers or of differentcombinations of plastic and metal layers or essentially purely metallayers. The core subassembly may also include:

(a) a semiconductor chip containing selected electronic circuits and anantenna coupled to the chip for enabling contactless radio frequency(RF) communication with an external reading device; and/or

(b) a semiconductor chip with contacts to an external surface of thecard to enable direct “contact” communication with an external readingdevice.

Cards embodying the invention include an energy absorbing buffer layerformed between a hard coat layer and a layer intended to be treated(e.g., personalized) with a laser.

BRIEF DESCRIPTION OF THE DRAWINGS

In the accompanying drawings, which are not drawn to scale, likereference characters denote like components; and

FIG. 1A is a highly simplified cross sectional diagram of a “core”plastic card sub assembly (subassembly A) which may be used inpracticing the invention;

FIG. 1A1 is an isometric diagram of a core, contactless, plastic cardsubassembly showing various layers of the subassembly including a layercarrying a chip and one carrying an antenna:

FIG. 1A2 is a highly simplified cross sectional diagram of a “corecontact” plastic card sub assembly (subassembly A) which may be used inpracticing the invention;

FIG. 1B is a highly simplified cross sectional diagram of a hard coatlayer sub assembly (subassembly B) intended to be combined with assortedcore subassemblies to form durable cards embodying the invention;

FIG. 1C is a highly simplified cross sectional diagram of a core plasticcard sub assembly (subassembly A) combined with a hard coat layer subassembly (subassembly B) in accordance with the invention;

FIG. 1D is a highly simplified cross sectional diagram of a resultantdurable plastic card with a hard coat layer in accordance with theinvention;

FIG. 2 is a highly simplified cross sectional diagram of a core plasticcard sub assembly (subassembly A) combined with hard coat subassemblieslocated on the top and bottom sides of the card;

FIG. 2A is a highly simplified cross sectional diagram of a resultantdurable plastic card with hard coat layers on the top and bottom side ofthe card in accordance with the invention;

FIG. 3A is a highly simplified cross sectional diagram of prior artplatens used in the manufacture of cards;

FIG. 3B is a highly simplified cross sectional diagram of platensembodying an aspect of the invention used in the manufacture of cards;

FIG. 4A is a highly simplified cross sectional diagram of a metal cardassembly for manufacturing a durable metal card in accordance with theinvention;

FIG. 4A1 is an isometric diagram of a core, contactless, metal-plasticcard subassembly showing various layers of the subassembly including alayer carrying a semiconductor chip and one carrying an antenna;

FIG. 4A2 is a cross sectional diagram of part of a core metal-plasticcard subassembly which includes a module and antennas so the subassemblycan be used to form a contact card and/or a contactless card;

FIG. 4B is a highly simplified cross sectional diagram of a resultantdurable metal card formed with a hard coat layer on the top and bottomsides of the card in accordance with the invention;

FIG. 5A is a highly simplified cross sectional diagram of a “brushed”metal card assembly for manufacturing a durable metal card in accordancewith the invention;

FIG. 5B is a is a highly simplified cross sectional diagram of a durable“brushed” metal card formed with a hard coat layer on the top and bottomsides of the card in accordance with the invention;

FIG. 6A is a highly simplified cross sectional diagram of an “embedded”metal card assembly for manufacturing a durable metal card in accordancewith the invention;

FIG. 6B is a highly simplified cross sectional diagram of a “hybrid”metal card assembly for manufacturing a durable metal card in accordancewith the invention;

FIG. 7 is a flow chart diagram showing various processing p in formingcards embodying the invention;

FIG. 8 is a diagram illustrating the use of an energy absorbing bufferlayer between a metal layer and a hard coat layer when the metal layeris subjected to a heat generating laser beam; and

FIG. 9 is a diagram illustrating the illustrating the use of an energyabsorbing buffer layer between a carbon containing PVC layer and a hardcoat layer when the carbon containing layer is subjected to a heatgenerating laser beam

DETAILED DESCRIPTION OF THE INVENTION

As shown in the various figures, cards embodying the invention include a“core” subassembly (subassembly A or A1, C, D, E, or F, or a subassemblyas shown in FIGS. 1A2 and 4A2) which defines the functionality of thecard to which is attached a hard coat subassembly (subassembly B); wherethe hard coat subassembly can be attached to the bottom and top sides ofthe core subassembly or to only one side of the core subassembly.

The “core” subassembly may comprise: (a) a number of plastic layersattached together as shown in FIG. 1A; or (b) a number of plastic layerswith a chip and antennas (a contactless “smart” card) carried on one ormore of the layers as shown in FIG. 1A1; or (c) a number of plasticlayers with a chip and antennas and a contact (a contact or contactless“smart” card) as shown in FIG. 1A2; or (d) a number of metal-plasticlayers, forming a hybrid card, as shown in FIGS. 4A and 4B; or (e) anumber of metal-plastic layers, forming a hybrid card, with a chip andantennas formed on or within some of the plastic layers (a contactless“smart” card) as shown in FIG. 4A1; or (f)) a number of metal-plasticlayers, forming a hybrid card, with a chip and antennas formed on, orwithin, some of the plastic layers and with contacts extending to asurface of the card as shown in FIG. 4A2; or (g) a number ofmetal-plastic layers, as shown as subassembly in FIGS. 5A, 5B, assubassembly E in FIG. 6A, and subassembly F in FIG. 6B. The coresubassembly could also be formed of a relatively thick metal layer.

An overview of the general processing steps performed in the manufactureof cards embodying the invention is shown in FIG. 7. As indicated instep 701 of FIG. 7, forming a “core” subassembly is one step in theprocess of making cards in accordance with the invention. As indicatedin step 703 of FIG. 7, another step in the process is forming a hardcoat subassembly B having a structure of the type shown in FIG. 1B.

The next step as shown in step 705 of FIG. 7, is forming a “sandwich”comprising the step of attaching a hard coat subassembly to the top andbottom sides of a core subassembly (as shown, for example, in FIG. 2) orto only one side of the core subassembly (as shown, for example, in FIG.1C).

The next step as shown in step 707 of FIG. 7 is to laminate the sandwichto form a reliable and firm card. Of significance in the manufacture ofcards embodying the invention is the use of a silicone rubber platedesigned to ensure that air bubbles are removed.

The next step shown in step 709 of FIG. 7 is the removal of the specialcarrier and release layer leaving the exposed hard coat layer(s). Afterthe removal of the carrier and release layers a resultant card isproduced as per step 711.

Also of significance in the manufacture of cards embodying the inventionis a lasering step to personalize/write on a metal core layer or on aPVC core layer of the card. The lasering step can be selectivelyperformed at any of several points during the process of making thecards (e.g., after step 701, or 705 or 707 or 709 or 711).

Some of the detailed steps in the manufacture of a durable card as shownin FIGS. 1A, 18, 1C and 1D include the following:

1—As shown in FIG. 1A, information (103 a, 103 b) may be printed in, oron, a core polyvinyl chloride (PVC) layer 101. A clear plastic layer 102a positioned above layer 101 and another clear plastic layer 102 bpositioned below layer 101 are laminated together with layer 101 usingstandard processing equipment. A magnetic stripe layer 120 may belaminated with layers 101, 102 a and 102 b at the same time orsubsequently thereto. The laminated assembly of layers 102 a, 101, 102 band 120 is identified as subassembly A, which represents a coresubassembly suitable for practicing the invention.

2—As shown in FIG. 1A1 subassembly A may be modified to include a layer100 carrying a booster antenna 14 and a layer 100 a carrying a chipmodule 12 and a chip antenna 13. Layers 100 and 100 a may be twoseparate layers or there may be one plastic layer carrying the chipmodule and the antennas. The chip module, also referred to as asemiconductor chip or an integrated circuit (IC) includes electroniccircuitry which is connected to antenna 13 inductively coupled toantenna 14 to enable the module 12 to communicate via contactless radiofrequency (RF) with an external card reading device (not shown). Forease of reference a subassembly A modified to include a chip andantenna(s) may be identified as a subassembly A1, which representsanother “core” subassembly suitable for practicing the invention.

3—Note that, as shown in FIG. 1A2, the subassembly A may also bemodified to include contacts extending from the module 12 to contactpoints 121, 123 along an external surface of a card. These contacts(121, 123) enable an external card reader (not shown) to directlycontact and interact with the chip module 12. The modified subassemblyalso represents another core subassembly suitable for practicing theinvention.

4—As shown in FIGS. 1B and 1C, a hard coat sub-assembly B is formed tobe combined with a core subassembly (A or A1) to form a durable cardembodying the invention. Subassembly B is referred to herein as a hardcoat subassembly. As shown in FIG. 1B, subassembly B includes a specialcarrier layer 104 on which is positioned a release layer 106 on which isformed a hard coat layer 108 on which is formed a primer layer 110 towhich is attached an adhesive layer 112. The layers forming subassemblyB can come in rolls or sheets (films) which are stacked on top of eachother in the prescribed order and then processed (combined) in thefollowing manner, Heat and pressure are applied to the layers formingsubassembly B fusing the stack of sheets (or rolls) together. The entirelamination process may occur in one or two steps depending on theequipment available. That is subassemblies A and B may be laminatedseparately and then combined. Alternatively, all the layers ofsubassemblies A and B can be stacked together as shown in FIGS. 1C and 2and then laminated at the same time.

5—The layers of subassembly B have significant properties, as discussedbelow:

a—special carrier layer 104, the carrier material is typicallypolyester, and is typically 0.00075 inches thick. The carrier layer isformed so that a release layer and a hard coat layer (also primer andadhesive) can be formed thereon and such that the carrier and releaselayer can be removed, leaving the hard coat layer (108 a, 108 b) as thetop (or bottom) layer of the card. The carrier layer 104 is importantdue to being specially designed to be compatible with the laminationprocess and to impart a special finish to the hard coat on the card.

b—The release layer 106 material is, by way of example, polyethylene waxand is approximately 0.00025 inches thick.

c—hard coat layer 108—The hard coat layer may be formed ofnano-particles, such as silicate nanoparticles, zinc oxidenanoparticles, silicon dioxide crystalline nanoparticles, or any othersuitable nano-particles with a suitable carrier such as a solvent ofwater based acrylates, vinyls, urethane or the like. The hard coat canbe applied by coating techniques such as gravure, reverse roil, directroll, or slot coating. This avoids the size limitation of the vapordepositing equipment. The hard coat layer (108 a, 108 b) is scratchresistant and provides a very strong and long lasting surface. Bendingand abrasion testing has shown that a plastic card with nano particlecoating is superior to any of the e-coat jewelry finishes currently inuse.

d—Primer layer 110—material is typically a plastic material such aspolyvinyl dichloride, or any like material, and is typically 0.0003inches thick. In accordance with the invention, the primer layer may bemade to have many different colors by adding colorants, dyes orpigments, to the plastic primer layer. This is very significant since itenables the manufacture of colored durable cards much more cheaply thanusing other known techniques. The color is compounded with the primerand solvents prior to its application to the sheet or roll.

e—Adhesive layer 112—may be, for example, polyvinyl acetate (PVA orPVAC), or any like adhesive or glue-like material. The adhesive layermust be such that it enables subassembly B to be bonded to a coresubassembly (e.g., A or A1); the subassembly whose components need to beprotected.

6—In accordance with one embodiment, the various layers of subassembly Bare bonded together in a platen press at a predetermined temperature fora predetermined time at a given pressure (e.g., 300 degrees F. at 200psia for 10 minutes).

7—A core subassembly (e.g., A or A1) and a hard coat subassembly B arethen combined together as shown in FIG. 1C or 2. The two subassembliesare then bonded (or laminated) together at a predetermined temperaturefor a predetermined time at a given pressure (e.g., 290 degrees F. at200 psia for 8 minutes).

8. Alternatively, all the layers of subassemblies A and B could bebonded (sandwiched) together in a one step process if the adhesivesystem is designed for the application.

9. The carrier layer 104 and the release layer 106 are then removed.Note that the hard coat subassembly with the carrier and release layerremoved is identified as B1 in the drawings. In one embodiment, theplastic carrier layer 104 and release layer 106 are hand stripped by alamination operator when breaking open the completed sandwiches(assemblies). Thus is formed a durable plastic card 10 of the type shownin FIG. 1D or 2A.

10. A card 10 with the hard coat layer embodying the invention has thefollowing properties: uniform surfaces which are scratch and abrasionresistant.

11. Laserability—A laser (e.g., a YAG laser) can be used forpersonalization of the resulting outside card surface. Note that alasering operation can be performed at many different points during themanufacturing process. The lasering may be performed at or on thesurface of a card assembly or two layers within the core subassembly.

11(a)—Laserability of cards which include only plastic layers—As shownin FIG. 1C, selected layers (e.g., clear PVC laminate layers 102 a, 102b or in an optional PVC overlay) of a core subassembly may be formed tocontain laser reactive carbon particles 901. Carbon particles and fumedsilica which can be laser reactive ingredients can be formed in theprinted PVC or polymer layer or in the polymer overlay. Heat from thelaser (e.g. 402) causes carbon particles in these layers to char and thesurrounding area turns dark. With extra power from the layer in the samespot the silica steams off its water and causes the area to turn a lightcolor. Thus the laser is capable of making both light and dark marks onthe same plastic surface.

11(b) Laserability of cards which include a metal layer—This processshows good contrast and is very secure since the hard coat layer can beablated down to the bare surface of the underlying metal. Note the hardcoat layer is either ablated if it is in direct contact with the metalsurface or unaffected (if adhesive and plastic layers are attached tothe metal surface) depending upon how the print and background qualitiesof the card affect the laser beam reflection and absorption. Sometimes,with a powerful laser the surface of the metal may also be affectedcausing bright bare metal to remain.

The manufacture and processing of the proposed product will result insignificant cost savings over alternative methods due to a reduction ofsurface scratching. Card life in the field is also extended.

FIGS. 2 and 2A illustrate that a hard coat layer can be formed on thetop and on the bottom (both sides) of a card, FIG. 2 shows that asubassembly B, denoted as B(a), can be attached to the top side of aplastic core subassembly A and that a like subassembly B, denoted asB(b), can be attached to the bottom side of subassembly A with B(b)being the symmetrically disposed mirror image of B(a) when folded aboutthe center core. The entire sandwich of subassemblies B(a), A and B(b)can be laminated as discussed above. After lamination, the carrier andrelease layers 104 a, 106 a and 104 b, 106 b are removed. This resultsin a card of the type shown in FIG. 2A where hard coat layers 108 a and108 b are formed as the topmost and bottommost layers of the card 10.The advantage of providing a hard coat layer 108 b over the magneticstripe layer 120 is that it would ensure that the magnetic stripe layerwould not be worn out over the useful life of the card. The hard coatcan be applied only over the magnetic stripe (leaving the signaturepanel open) or if a full layer of hard coat is applied, a lasersignature can be used during personalization instead of a customer handsigned card signature.

The lamination step includes the use of separate heated and cooledplatens to apply pressure at a predetermined temperature to thesandwich. Prior art platens as shown in FIG. 3A include the use ofstandard polished steel plates (301 a, 301 b) heated to the desiredtemperature to apply the desired pressure to selected layers. A problemwith the prior art platens was that air bubbles within the layers couldnot escape. This caused defects on the laminated sheet. This problem isovercome by replacing the polished steel plates/pads with siliconerubber plates 311 a, 311 b, as shown in FIG. 3B, to laminate cardsembodying the invention. The use of a silicone rubber pads over theplatens can provide a degree of flexibility in that it allows pressingof the hard coat into irregular areas of the sheet. This helps squeezeout air bubbles.

Furthermore to overcome problems of manufacture and completely removeair entrapment a special vacuum lamination platen under heat andhydraulic pressure can be used with a high heat high pressure shortcycle. The cards shown in the figures and formed in accordance with theinvention benefit from the vacuum lamination process by completelyremoving air form the process.

The handling methods developed overcome lack of surface consistency byusing special 30 durometer 032 to 062 thick silicone rubber—with orwithout vacuum, Lamination using silicone rubber platens also canovercome lack of surface consistency by providing a more even pressurewhich overcomes any inconsistency in material surface and thickness.

Relative to a metal core or hybrid card using the hard coat techniqueallows the user to achieve a holographic, multi-dimensional effect onstainless steel or similar metal substrate with a polished or millfinish by laser engraving an image removing a physical vapor deposition(PVD) or like pigmented coating. This may be achieved by creating apseudo lenticular lens, and changing the refractive index of the imageon different layers. This may be further enhanced by creating apolarization pattern in the layers, creating a polarized light effect.

Metal Cards

In accordance with the invention, the hard coat subassemblies may becombined with core subassemblies which include metal layers to formmetal-plastic or mostly metal cards which are highly scratch resistantand even more durable.

FIGS. 4A and 5A are highly simplified cross sectional diagrams of aprimarily metal card assembly for manufacturing a durable metal card inaccordance with the invention. The metal layer 101 may include anoptional adhesive film (103 a, 103 b) above it top and bottom surfaces.The optional adhesive films 103 a, 103 b are desirably used when the topand/or bottom surface of the metal layer 101 has been “brushed” as shownin FIG. 5A. The “brushing” may be accomplished by forming indentationsin the surface of the metal layer done to give the metal layer and theresultant card a distinctive feature. The films 103 a and 103 b whenapplied to the brushed metal surfaces tend to smooth out the sharp edgesand fill the depressions present on the brushed surfaces. This solves aproblem when the ridges formed in the metal surfaces due to the“brushing” exceed the thickness of the hard coat layer and tend to wearthrough the hard coat layer. The core metal card subassembly (C in FIG.4A, D in FIG. 5A) is shown to include a magnetic stripe and/or ahologram layer 120 on the bottom side of the metal layer. In FIGS. 4Aand 5A, the card assembly sandwich also includes a sub assembly Baapplied (sandwiched) on top of the optional adhesive film 103 a and asubassembly Bb applied (sandwiched) below layer 120.

Note that the metal layer 101 may be stainless steel and have a“whitish” color. There is provided in subassemblies Ba and Bb a primerlayer 110 a, 110 b which may be colored to give the card a desiredcolor. Alternatively, the primer layer may be clear.

The sandwich assembly shown in FIGS. 4A and 5A is subjected to alamination process under predetermined pressure and temperature.Thereafter, the carrier and release layers are removed leaving aresultant card of the type shown in FIG. 4B or 5B, Thus, FIGS. 4B and 5Bare highly simplified cross sectional diagrams of a durable scratchresistant metal card formed with a hard coat layer on the top and bottomsides of the card in accordance with the invention. In FIGS. 4A and 5A,the thickness of the metal layer 101 may be, but need not be, nearly thefull thickness of the card.

FIG. 6A is similar to FIGS. 4A and 5A except that an additional printedclear PVC layer 105 a is applied above the metal layer 101 and anadditional printed clear PVC layer 105 b is applied below the metallayer 101. The PVC layers 105 a, 105 b, enable the metal layer 101 ofFIG. 6A to be made thinner than the metal layer 101 of FIGS. 4A and 5A.For example, the thickness of its metal layer may be ⅓ that of FIGS. 4Aand 5A. FIG. 6A may be referred to as a durable card with an “embedded”metal layer.

FIG. 6B is similar to FIG. 6A except that at least one of the PVC layersmay be eliminated. The metal layer of FIG. 6B would be thicker than thatof FIG. 6A but thinner than that of FIG. 4A or 5A. FIG. 6B may bereferred to as a hybrid durable metal card. Note that the resultantcards formed from the assemblies shown in FIGS. 6A and 6B have a hardcoat layer on their top and on the bottom surfaces.

As already discussed a “core” subassembly as used herein refers to thoselayers of the card which define the functionality or function to beperformed by the card. A “core” subassembly may be a subassembly such asdefined as subassembly A, A1, or in FIG. 4A2, C, D, E or F).

FIGS. 8 and 9 illustrate a solution to a problem which exists when ahard coat layer is used. It is noted that a problem exists when a hardcoat layer is formed so as to be in direct contact with a metal layer ora plastic layer containing laser reactive (e.g., carbon) particles andthe metal layer or a plastic layer undergoes a lasering operation. Whenthe laser is applied to the metal layer or to the laser reactive plasticlayer, a substantial amount of heat (energy) is generated. When thisgenerated heat is applied to the hard coat layer, the hard coat layer issubjected to cracking and to being effectively destroyed.

In FIG. 8 the “cracking” problem is overcome by forming an energyabsorbing layer (e.g., 808 a, 808 b) between a metal layer (e.g., 101)and associated hard coat layers (108 a, 108 b). The energy absorbinglayer (e.g., 808 a, 808 b) may be of any suitable material to absorb ordissipate the energy generated to prevent cracking of the hard coatlayer. In some embodiments a primer layer 110 in addition to an adhesivelayer 112 formed between the hard coat layer and the metal layer weresufficient to protect the hard coat layer from the heat generated by thelaser's action. An energy absorbing buffer layer may be comprised, forexample, of an extruded polymer film, and can be composed of any of thepolymeric films known in the art such as PET (PolyethyleneTerephthalate), PETG (Polyethylene Terephthalate Glycol), or PVC(Polyvinyl Chloride).

In FIG. 9 the “cracking” problem is overcome by forming an energyabsorbing layer (e.g., 908) between a laser reactive carbon containingplastic layer (e.g., 902) and associated hard coat layers (1080. Theenergy absorbing layer (e.g.; 908) may be of any suitable material toabsorb or dissipate the energy generated to prevent cracking of the hardcoat layer, as discussed above for FIG. 8.

Although the invention is illustrated and described herein withreference to specific embodiments, the invention is not intended to belimited to the details shown. Rather, various modifications may be madein the details within the scope and range of equivalents of the claimsand without departing from the invention.

What is claimed:
 1. A laser-personalized card product comprising: afirst core subassembly comprised of two or more layers which include oneor more elements that define functionality of the card, said first coresubassembly having a top layer and a bottom layer; a second subassemblyincluding a hard coat layer attached to a release layer which is mountedon a carrier layer; the second subassembly being attached to the toplayer of the first core subassembly so the hard coat layer is arrangedclosest to the first core assembly to form a first card assembly; and afinish imparted to the hard coat layer of the card by the carrier layeras a result of laminating the first card assembly under predeterminedtemperature and pressure.
 2. The laser-personalized card product ofclaim 1, wherein the hard coat layer includes nano-particles and acarrier for said nano-particles.
 3. The laser-personalized card productof claim 1, wherein the hard coat subassembly includes a plastic primerlayer underlying the hard coat layer, and the plastic primer layercomprises colorants, dyes, or pigments.
 4. The laser-personalized cardproduct of claim 1, wherein the second subassembly attached to the toplayer of the first core subassembly is a top second subassembly, thecard product further comprising a bottom second subassembly attached tothe bottom layer of the first core subassembly to form said first cardassembly.
 5. The laser-personalized card product of claim 1, wherein thefirst core subassembly comprises a core plastic layer, a plurality ofclear PVC layers with graphics on one or more selected PVC layers, and amagnetic stripe.
 6. The laser-personalized card product of claim 5,wherein the first core subassembly comprises at least one of thefollowing: (a) an integrated circuit and an antenna configured to enableradio frequency communication with an external reading device; and (b)an integrated circuit with contacts extending to a surface of the cardconfigured to enable direct contact and communication between anexternal device and the integrated circuit.
 7. The laser-personalizedcard product of claim 1, wherein the first core subassembly includes ametal core layer.
 8. The laser-personalized card product of claim 7,wherein the first core subassembly comprises at least one of thefollowing: (a) an integrated circuit and an antenna configured to enableradio frequency communication with an external reading device; and (b)an integrated circuit with contacts extending to a surface of the cardconfigured to enable direct contact and communication between anexternal device and the integrated circuit.
 9. The laser-personalizedcard product of claim 1, further comprising exposed portions of thefirst core subassembly.
 10. The laser-personalized card product of claim5 wherein one of said layers forming said first core subassemblyincludes laser reactive particles.
 11. The laser-personalized cardproduct of claim 2, wherein the nano-particles are selected from thegroup consisting of: silicate nanoparticles, zinc oxide nanoparticles,and silicon dioxide crystalline nanoparticles.
 12. A laser-personalizedcard product comprising: a first core subassembly comprised of two ormore layers including one or more elements that define functionality ofthe card; said first core subassembly having a top layer and a bottomlayer; first and second hard coat subassemblies each including a hardcoat layer attached to a release layer which is mounted on a carrierlayer; said first hard coat subassembly being attached to the top layerof said first core subassembly and the second hard coat subassemblybeing attached to the bottom layer of said first core subassembly toform a first assembly; a finish imparted to the hard coat layer of thecard by the carrier layer as a result of laminating the first assembly.13. A laser-personalized card product formed by a process comprising thesteps of: forming a hard coat layer which contains nanoparticles, saidhard coat layer tending to crack when subjected to a predeterminedintensity of heat; forming a subassembly including attaching the hardcoat layer to a release layer mounted on a carrier layer; forming aninternal core layer which includes one or more elements the definefunctionality of the card and which includes a laser reactive layeradapted to be personalized by a laser beam; forming at least one bufferlayer between the hard coat layer and the core layer, said buffer layerfunctional to absorb energy and to dissipate heat energy produced at andwithin the internal core layer during application of the laser beamsufficient to prevent the hard coat layer from being subjected to thepredetermined intensity of heat; laminating the combination comprisingthe subassembly, the buffer layer and the internal core layer; removingthe carrier and release layers, leaving the hard coat layer attached tothe buffer layer and the buffer layer attached to the internal corelayer; selectively exposing the laser reactive layer in the internalcore layer to the laser beam; and personalizing the internal core layerof the card by lasering through the hard coat layer and the buffer layerbefore impacting the internal core layer at a temperature that (i)causes the laser reactive layer to react and transfer heat to the bufferlayer, and (ii) is below the cracking temperature of the hard coatlayer, to avoid cracking the hard coat layer.
 14. The laser-personalizedcard product of claim 13, wherein the step of laminating the combinationcomprising the subassembly, the buffer layer, and the internal corelayer includes using a rubber platen to remove air trapped between thelayers of the combination.
 15. A laser-personalized card product havingan external hard coat layer comprising nano-particles, said hard coatlayer tending to undergo an adverse effect when subjected to apredetermined intensity of heat, said hard coat layer overlying aninternal core layer which includes a laser reactive layer adapted to bepersonalized by a laser beam, the hard coat layer disposed in a positionin which the laser beam passes through the hard coat layer beforeimpacting the internal core layer, and wherein the laser reactive layerhas a tendency to develop heat at or above said predetermined intensityadjacent to points exposed to the laser during laser personalization,the laser-personalized card product formed by a process comprising thesteps of: forming at least one buffer layer between the hard coat layerand the core layer, said buffer layer functional to absorb and dissipatethe heat energy produced at and within the core layer during laserpersonalization sufficient to block the heat energy and prevent theadverse effect in the external hard coat layer; and personalizing theinternal core layer of the card by lasering through the hard coat layerand the buffer layer before impacting the internal core layer at atemperature that (i) causes the laser reactive layer to react andtransfer heat to the buffer layer, and (ii) is below the crackingtemperature of the hard coat layer, to avoid cracking the hard coatlayer.